2008年5月5日 星期一

整理_5


PMU: POWER UNIT、PWR I2C I/F
  • Power Manager I2C Interface / I2C Interface
    The PXA27x processor contains a dedicated I2C module for communicating with an external regulator. “I2C Bus Interface Unit” for a full description. The only differences
    between the power manager I2C (PWR_I2C) and the standard I2C interfaces are the register addresses.
POWER MICRO: SSP I/F
  • It is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the MCU achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.
  • The SSP ports are a synchronous serial interfaces that connect to a variety of external analog-todigital(A/D) converters, audio and telecommunication Codecs, and many other devices that useserial protocols for data transfer. The SSP ports provide support for the following protocols:
    • Texas Instruments (TI) Synchronous Serial Protocol
    • Motorola Serial Peripheral Interface (SPI) protocol
    • National Semiconductor Microwire
    • Programmable Serial Protocol (PSP)
    The SSP ports operate as full-duplex devices for the TI Synchronous Serial Protocol, SPI, and PSP protocols and as a half-duplex device for the Microwire protocol.
    The FIFOs can be loaded or emptied by the CPU using programmed I/O or by DMA burst
    transfers.
LCM: SPI I/F、LCD I/F


燒錄BT mac address
mon>man bt 00:00:00:00:00:00
確認BT mac address
mon>man bt
00:00:00:00:00:00

Gerber out
RD畫電路→給Layout lay電路→PCB送洗

整理_4


CAMERA: IMAGE I/F、I2C I/F
1D/2D IMAGER: IMAGE I/F、I2C I/F
KEYBOARD: I2C I/F

整理_3



WLAN: SDIO
Micro SD: SDIO
GPS: FF-UART
DUAL UART: CPLD External Bus
MDOC: PXA270 External Bus
SDRAM: PXA270 External Bus
CPLD: PXA270 External Bus、JTAG
  • CPLD is designed for both high performance and low power applications.
    This lends power savings to high-end communication equipment and high speed to battery operated devices. Due to the low power stand-by and dynamic operation, overall system reliability
    is improved.This device consists of sixteen Function Blocks inter-connected
    by a low power Advanced Interconnect Matrix (AIM).